Category: Service

APIC performs failure analysis on voids of die attachment.

APIC performs wire pull, ball shear, and die shear tests!

APIC provides top-notch testing for semiconductor lasers and photodiodes. Device configuration options: on sub-mount in package Tests we can run on lasers: LIV Spectra RIN Tests we can run on photodiodes: Vf & VBr IDk Responsivity Saturation

APIC delivers the ability to cut wafers between 1 and 8 inches in diameter. We can cut many materials, but the wafers we primarily cut are : Si AlN SiC

With an alignment efficiency of greater than 95%, APIC is able to laser weld in package with our two-beam laser welder and omega-shaped clips. We can work with fiber ferrules between 0.9 – 1.2 mm.

APIC performs three main types of wirebonding: Ball Wedge Ribbon We can perform wirebonding for devices that are either on a submount or in package.

APIC is able to attach dies to flip chips that measure from 0.3 x 0.3 mm to 2 x 2 mm, and have a submount that is up to up to 40 mm2. Accuracy: +/- 0.001 mm